An injection molding apparatus having a nozzle which includes a first nozzle body segment, a second nozzle body segment, and a thermal barrier coupled between the nozzle body segments. Each compound relocation has a type field denoting a compound relocation type indicator and an offset field indicating the offset where the compound relocation is to be expanded. In one aspect, a leaf spring or other flexible member can be moved to define a curved coin path portion with adjustable width and a preferably contiguous rail can be laterally transposed to adjust a width of a second portion of the coin path. These regions serve to prevent the spring from being laterally displaced during torsional motion, thus minimizing the relative motion at the spring contact points, reducing stress on the spring, and improving the efficiency of the spring by reducing frictional hysteresis. A deconvolution method may then be applied to the high-resolution observed image to deblur the image. At least one of the first pinned layer and the free layer includes a first metal magnetic film contacting the first non-magnetic layer, and a first oxide magnetic film.