Image compensation value computation techniques are described. The LED chip package body further has a light-reflecting coating disposed on the pad-installed surface of the LED chip and a plurality of pad-exposed holes for exposure of the corresponding pads of the LED chip. The mirror assemblies operate properly with or without an external flashing circuit. A ring pocket is sewn within the strap. The polymers of the invention are useful as polyvinyl chloride plasticizers. A plurality of triangular-shaped serrations are positioned along the cutting edges, each serration comprising an apex and a pair of side surfaces that meet at a vertex.