A method for fabricating a semiconductor component includes the steps of providing a semiconductor die, forming a plurality of redistribution contacts on the die, forming a plurality of interconnect contacts on the redistribution contacts, and forming an insulating layer on the interconnect contacts while leaving the tip portions exposed. At the receiving side, the clock is recovered from the serial words, and the serial words are converted back to parallel form. In the case of a DIMM, the RF integrated circuit chip and its antenna traces are located on top of or between the layers of a multi-layer laminated printed wiring board substrate. Articles of manufacture including frozen pellets, as well as optional objects such as straws, spoons, and mixing containers are disclosed.