A handheld electronic device including a main body, a first magnetic member and a stylus is provided. The method comprises the acts of measuring the dimensions of the workpiece during a surface treatment operation and adjusting the surface treatment process parameters to account for the measured dimensions. The system further includes a process volume adjustment mechanism coupled to the process chamber and configured to create a second process space that includes at least a part of the first process space and that has a second volume less than the first volume, the substrate being exposed to the second process space.