A semiconductor device which is formed in a self-aligned manner without causing a problem of misalignment in forming a control gate electrode and in which a leak between the control gate electrode and a floating gate electrode is not generated, and a manufacturing method of the semiconductor device are provided. In addition, at least one of an active cooling mechanism and a three-dimensional package is controlled based upon at least one of the identified workload and environmental condition. The regulating member includes a passage recess that is connected to the inflow hole, a liquid medicine-delivering groove connected to the outflow hole, and an insertion hole to be equipped with the fastening member. A correspondingly adapted run-time system is also provided, which is suitable for implementing the procedure as well as the integration of this run-time system into an automation facility.