Reflow soldering of a variety of circuit boards in a variety of sizes and shapes to assigned locations on the base or carrier of the electronic module housing is simplified by eliminating custom made metal blocks previously used to clamp the circuit boards against the carrier metal. A printing apparatus is connected to an information processing apparatus that instructs printing execution, is connected to a server via a network, and executes printing according to a print job generated by the information processing apparatus. The segmented construction with segments of different magnetization directions allows small changes in the orientation of the magnet to substantially change the magnet field direction at a system operating point. The composition of the invention is useful for paving, roofing felts, water-proof membrane, adhesive, mopping asphalt, carpet backing and pipe coating applications. The Phi-nodes may be selectively disabled, for example, at run-time. The VAP also allows the user to manually adjust the volume of all of the participants or an individual participant using a plurality of navigation buttons.