A reservoir may be filled with fluidic media in a first type of environment, a plunger head may be placed within the reservoir in the first type of environment, and a casing that may be configured to envelop at least a portion of a plunger arm operatively connected to the plunger head may be attached adjacent to at least a portion of the reservoir in a second type of environment. An outer hub is disposed about the inner hub and has an opening through which the flexible leader extends. A second conductor is vertically formed in a semiconductor stack that includes the semiconductor substrate. Independently operated heaters are provided on the manifold assembly to heat the trays to desired temperatures. A pressure release vent communicates with the cup cavity, a vent channel between the cup portion and the exterior surface, the vent cavity, and the exterior environment. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.