The present invention relates to a pallet transportation assembly comprising a first tine, a second tine, and a body coupled to the first and second tines comprising a tine adjustment system, a wheel, and a vertical backing portion, wherein the first or second tine further comprises a riser hinged to the first or second tine. A patterned dielectric layer and a patterned semiconductor layer are formed to cover portions of the scan lines. A hub is coupled to the motor and, with the motor support, forms a motor enclosure that substantially surrounds the motor. Supporting arms extend from the base portion in the first direction, outboard of respective vibrating arms. The gradient field coil system is also a main magnetic field generation system for generating a main field. Accordingly, it is possible to obtain a high bonding strength and desired sensor characteristics without causing bonding voids to occur and a sensor chip to increase in size.