There is provided a low dielectric constant material, which is excellent in thermal resistance, has low dielectric constant, and is applicable to a semiconductor device or electric appliances, an insulation film between semiconductor layers using the same, and the semiconductor device. The semiconductor device may include a semiconductor substrate having a cell array region and a peripheral circuit array region, and a plurality of process monitoring patterns disposed in the peripheral circuit array region. The closure component is pivotally attached to the body to provide the compartment with either an open or closed position.