The invention relates to a membrane that consists of a polymer or a polymer mixture. The insert block comprises one or more pushers, installed in a block body having a loading space to accommodate a semiconductor device under test, including a first push rod to apply force to one of adjacent sides of the semiconductor device under test and a second push rod to apply force to the other thereof. The positions of the probe tips are mapped and checked for skew of the probe array. The buffer layer preferably is a silicon oxide layer with a thickness substantially smaller than a thickness of the passivation layer. The device comprises a structure comprised of a helical substituted polyacetylene having a helical main chain, and a pair of electrodes for applying a voltage or electric current to the structure, wherein the molecule of the helical substituted polyacetylene has a length larger than the distance between the pair of the electrodes. This fusing device further includes a roller member regulator for regulating the press-contact state when the fusing roller and pressing roller are put in press-contact with each other by the pressing spring.