A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. The process also involves processing the electronic document by optimizing sizes of one or more images embedded in the electronic document, optimizing sizes of one or more Type 1 fonts in the electronic document, and removing object duplicates in the electronic document. During the call, a sequence of key strokes is received from the member who uses customer premises equipment during the call. By adding a transverse stiffener, the strength of the original extrusion may not only be restored but also further improved. The background subtraction, gradient calculation and associated compression require simpler, less expensive circuitry than for typical image pre-processing boards. The engine optionally includes a bearing gallery cooling air jacket in communication with the low pressure compressor stage for the purpose of cooling.