An electrically conductive interconnect is provided through an opening in a dielectric layer, electrically connecting two conductive layers. The virtual network environment encapsulates a set of applications within a virtual network and prevents applications from interfering, either maliciously or unintentionally, with other applications outside of its virtual network environment. The invention further relates to corn seeds and plants produced by crossing plants of variety CV596742 with plants of another variety, such as another inbred line.