A method of fabricating a copper-containing structure, preferably within a microelectronic device, including a rapid temperature ramp from about 20 degrees Celsius up to between about 300 and 500 degrees Celsius, preferably about 400 degrees Celsius, at a rate of between about 20 and 60 degrees Celsius per second, preferably about 40 degrees Celsius per second. According to one aspect, a device may include an antenna for wirelessly transmitting a power signal at a power carrier and data signal at a data signal carrier. An Automatic Notification function checks to see if any \u201ctriggering\u201d events have occurred when a user performs a particular task. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.