In a method for manufacturing an electronic component, when conductive paste used to form outer electrodes is applied to a component body, a side surface of the component body is subjected to an affinity-reducing process to reduce an affinity for solvent, and then an end surface of the component body is dipped into the conductive paste. The body is configured to releasably accommodate a first mass member in a first region on its back surface and a second mass member in a second region on its back surface. The file is then distributed via the peer-to-peer network to other members of the peer-to-peer network.