Dynamic media asset delivery is described. The semiconductor package may include a semiconductor chip stacked over the structural body, and having an overhang portion projecting over a side surface of the structural body and overhanging out over the side surface of the structural body. If specification information for specifying a predetermined pattern from among the plurality of patterns of information which has been stored in the storage circuit is input, an activation circuit activates each content addressable memory word block according to a specified pattern. The outer shell is molded with ridges extending in loops that facilitate correct gripping and avoid slipping of the thumb on the connector. A touch-sensitive panel is mounted on the front display in registration with the front image area. Both the single-control phase shifter and the hybrid power divider can comprise substantially planar structures that are suitable for high-speed manufacturing.