Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin with, on average, more than one epoxide group per molecule, at least one curing agent for epoxy resins, which is activated by an increased temperature and at least one terminally blocked polyurethane prepolymer. A first pin is coupled to a first block. The sense period of the read cycle is overlapped with the decoding period of the write cycle.