A semiconductor device includes a substrate, and a through electrode passing through the substrate. In this fitting method, a tire is fitted to a wheel, and then core positions of fastening holes are, or a core position of a hub hole is, adjusted in the wheel to minimize an amount of eccentricity of an assembled body including the tire and the wheel. By using this method, a conductive coating film having excellent adhesion to a substrate can be formed on an ordinary paper substrate, plastic substrate and glass substrate at low temperature in short time. The width of the strip is several times larger than the length of a vortex generator.