The invention refers to a method for exposing a layout comprising multiple layers on a wafer, in which at least one layer is exposed photolithographically and subsequently at least one further layer is exposed with an electron beam, and the wafer is to be aligned in defined fashion with respect to the electron beam exposure system in terms of the previously photolithographically exposed layer. The endoscope includes an elongated flexible probe with a housing at its proximal end to control the direction and operation of the probe and for viewing images carried by optical fibers from the distal end of the probe. The element serves as a window to facilitate the curing of light-curable orthodontic adhesive beneath the appliance base, while simultaneously preventing movement of the adhesive through the passageway. A cooling speed is calculated in each element by performing a calculation of heat transfer between the elements adjacent to each other.