Several techniques are described for reducing or mitigating the formation of seams andor voids in electroplating the interior regions of microscopic recessed features. 20 or greater as calculated by the following relationship 1,Shape factor=2Projected area of particle)\xd7\u2003\u2003Relation 1. The chip buses are compatible with either a surface mounted or a plug-in mounted encoder module assembled to a printed circuit board platform having alternate disc track read locations provided by separate encoder module bus ports. The inner conduit has external fins where at least some of the external fins contact the inner surface of the spray tip. In the region of interest re-designating process, the user clicks the mouse on the MIP image, and the CPU determines the MIP position of the clicked position.