A method for epitaxially forming a first semiconductor structure attached to a second semiconductor structure is provided. The substrate holder is adapted to be joined tightly to the covering unit, so that passage holes arranged circumferentially on the substrate holder so that an internal coating space, defined by the covering unit and the substrate holder, is in fluid communication with the environment outside the internal space. When signals are transmitted from the terminal to the application platform via the signal transmission path, the signal is converted in an opposite way. Thereafter, a communication session is established using the addressing information for retrieval of a bootstrapping digital certificate that can be digitally verified by the network device using its factory settings. The device burns clean with a minimum of smoke and harmful or noxious fumes. The milling tool system provides a minimally invasive procedure to provide an aperture within an exposed surface of the tibia, the aperture then being used as a referencing surface to accurately resect the femur.