Methods and apparatus for processing substrates to improve polishing uniformity, improve planarization, remove residual material and minimize defect formation are provided. The semiconductor film is irradiated with laser light to melt the semiconductor film and the melted semiconductor is poured into the concave portion, where it is crystallized. The first spacer ring is sandwiched between the first lens and the second lens, the second spacer ring is sandwiched and located between the second lens and the third lens. A tone mapping procedure is performed on the primary image layer, for generating a tone mapping layer.