An under bump metallurgic layer which is adapted for a chip is disclosed. The capsule includes a circumferential first wall, a second wall closing the circumferential first wall at a first end, and a flexible sheet-shaped perforate andor porous third wall closing the circumferential first wall at a second, open, end opposite the second wall. This allocation can be done based on the data rate, latency, BER, impulse noise protection requirements of the application, data or information being transported over each latency path, or in general any parameter associated with the communications system. The first terminals of the first and second transistors receive the injection signal. An integrator is coupled to the peak detector to receive the peak signal and produce an integrated signal and a mixer is coupled to receive the integrated signal and a transmit power indicator to produce a current control signal that is coupled to the LNA. The flexible head member is adapted to be received by the structure to secure the accessory to the structure.