Epoxy probe cards are modified by mounting passive andor active electronic components on the insulating surface of the probe card and connecting those components to the probe wires with short, electrically conductive lines that are formed on the probe card surface by printed circuit techniques. The brush includes a NiTiNOL shaft attached to a fill section by way of a proximal connector sleeve that is resistance welded to the fill section and the shaft. A bundling unit will not transmit a response signal to the base station in certain cases.