A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The encoded image projection system includes a light encoder that scans a non-visible light beam on the projection surface selectively when scanning visible light to create an image. Furthermore, the invention relates to a method for recoating such a hob cutter tool.