The invention proposes a semiconductor configuration having a substrate, which has at least one component integrated therein. Where a signal traverses an initial outgoing path and a return path, delay elements disposed in each of the paths may be adjusted in order to set the entirety of the delay of the signal having traveled the entire signal trajectory equal to the delay present in a deliberately introduced delay element of known value. The temperature sensor is mounted at the front part of the hot air discharging duct so that an operator has easy access to the temperature sensor. A controller can be connected to the transducers, fans, and a power supply. Each fin plate may have a varying edge profile along an outwardly extending edge thereof.