An apparatus for cleaning a semiconductor wafer is disclosed to substantially improve the efficiency of the cleaning process, and reduce the quantity of cleaning solvent used. A coating that covers the connecting region is then applied to the regions of the trenches in which the connecting region is exposed. Further, user selected rules of operation can be selected by dragging rule icons to target optimizer icon. The rotor has blades that obstruct the flow of drilling fluid through the passages when the rotor is rotated into a first orientation and that relieve the obstruction when rotated into a second orientation, so that oscillation of the rotor generates the encoded pressure pulses.