An image sensor and an image sensing method are provided. A through via may be formed through the substrate aligned with the via in the molding with an electrically conductive liner deposited in the through via in electrical contact with the conformable metallic layer. Additionally, the invention can be mounted on a foundation beneath the structure. A plurality of resources may be identified, where the plurality of resources is a pool of resources configured to store a backup of one or more data values stored in the at least one storage location. In response to receiving the instruction and before execution of the instruction, the at least one processor or processor core causes ones of the plurality of mutually communicatively inter-coupled processor cores to provide a plurality of locally stored values that are stored individually in the respective processor cores and that are associated with the memory address.