The planes of chips in a flip-chip arrangement, when at least one of the chips has an insulating layer running through it, may be electrically connected together by incorporating into the top chip a flexible metalized structure which is pinned to the top layer of the bottom chip using a wire bond ball which is connected to a wire that is attached to a pad on the top layer of the upper chip. The heat shield assembly has an inner surface facing the manifold body and spaced apart therefrom by an inner air gap, which substantially surrounds the manifold body, defined therebetween. The processing circuit is configured to monitor data transactions of at least one of the computing servers, which is associated with a user account.