Solder ball assembly for a semiconductor device and method of fabricating the same is described. The one or more base layers provide support to the adhesive layer, whereas the adhesive layer comprises one or more fluorescent materials that convert at least a portion of incident electromagnetic radiation to a longer output wavelength. The first andor second member is composed at least partially of a membrane which is located either in the region of the recess or on the part of the other member that is opposite to the recess such that substances can be taken up from the surrounding fluid by means of the membrane. Alternatively, the first end of the tubular connector may be slidably received within a manifold bore in the downstream surface of the manifold or within a manifold melt channel with the second end of the tubular connector being threadably andor permanently attached within a nozzle bore in an upstream surface of the nozzle.