A semiconductor structure and a manufacturing method of the same are provided. In the semiconductor device, the driver circuit generates a signal to be output to a th signal line with the use of a signal to be output to a j-th signal line. A composite web made up of a preprinted web having a series of axially spaced apart images or segments on one surface and an opposed adhesive-bearing surface and a release-coated liner web is fed to the apparatus and first separated, with the liner web being collected in a takeup roll while the preprinted web is directed along the conveyor through the laser cutting station. Further, an acceleration coefficient is obtained based on the internal temperatures, a burn-in time is determined based on the acceleration coefficient and a preliminarily given accelerated period, and a burn-in acceleration test is conducted. Other embodiments are described and claimed. The microcontroller reduces the duty cycle of the output signals if the current flow rises above a first threshold and resumes the output signal to full strength once the current flow falls bellow a second threshold.