A micromachined piezoelectric microspeaker and its fabricating method are disclosed. The invention further relates to a method for establishing a link between a first semiconductor element and a second semiconductor element which have different outer contours, the two elements being interlinked by eutectic bonding when already being present as a wafer composite. Thereafter, the image information and new metadata are rendered available to other processes that use the image information and new metadata. Further, in step S40 as well, the pressure difference is kept at the minimum value at which the semiconductor wafer is not allowed to slide over the protrusions. The method of this invention considers all design cells, identifies corresponding candidate cells having the same function and swaps a candidate design cell having a least leakage current for the design cell. Polymers formed from the functionalized diphenolics are expected to have controllable degradation profiles, enabling them to release an active component over a desired time range.