Copper plating baths containing a leveling agent that is a reaction product of one or more of certain pyridine compounds with one or more epoxide-containing compounds, that deposit copper on the surface of a conductive layer are provided. In parallel with the execution of the application, tamper check is performed on the application using a tamper check thread. The source server transmits replication data from the source server with repair data from the source server to the target table in accordance with a commit order of the replication data and the repair data. The cost function is based on the comparing of the representation of the handwritten pattern to the candidate pattern and on the comparing of the subconfigurations to the selected subconfiguration candidates in the candidate pattern. The plurality of teeth are disposed along a circumference centered on the rotation axis at a predetermined interval from one another.