A antireflective film 50 is formed on a thermocouple 42 arranged in a processing vessel 1 of a heat treatment apparatus in order to improve the transient response characteristics of the thermocouple 42. In some examples communication link handoff logic may be executed by the processor component to receive user feedback during a test voice call mediated with a call server, the user feedback pertaining to one or more Voice-over Internet Protocol communication link parameters for the communication link between the hybrid mobile device and the call server. Pinch-off circuitry receives the input signals and prevents voltage above a threshold voltage from being applied to an output of the pinch-off circuitry. Pull notifications merely specify an address where update information is available.