An ink composition includes a colorant, a solvent, and an amide compound. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit in the same time. Following attachment, the receiving body portion and the stirrup connection portion can rotate relative to one another about an axis defined generally by the crossbar within the retention pocket. A smoothing bias current is applied to the largest amplification stage after the pulse decays to compensate for transient bias current levels while standard bias circuitry is still approaching steady-state temperature.