A wide-angle imaging device suitable for a monitor area of about 180 degrees. In addition, the CMUT can include a back side bond pad structure that eliminates the need for and cost of one patterned photoresist layer. Debugging data is associated with relevant components of the model displayed in the graphical view. Because the conductive wires are soldered onto the conductive plates, the semiconductor chip does not receive impact of wire bonding. Contacts for resistivity measurement are directly connected to the resistivity measurement floating gate.