A system for computer-aided identification of technical phenomena and related methods, particularly with technical problems is described. The electrically insulative element is connected to the first electrically conductive element and the second electrically conductive element. In a first memory chip and a second memory chip, first pads of the first memory chip located at a lower stage and hidden by the second memory chip located at an upper stage are drawn out by re-wiring lines, whereby the first pads projected and exposed from the overlying second memory chip and second pads of the second memory chip can be coupled together through wires.