A semiconductor device is made by providing a metal substrate for supporting the semiconductor device. The moulds are advanced to a pouring track or guideway, on which the casting moulds are formed by positioning the mould parts close together and the advancement of the casting moulds is stepwise through a pouring station, in which the moulds are filled with molten metal. As the identity of the input andor output model parameter change, or as the analytics themselves change, the dependency graph may also change. 5 \u03bcm and wherein the weight ratio of the nano-particles to the non-spherical reinforcing particles is below 0. The router, located on the Z-arm, moves downward to engage a router bit to the panel to depanel the printed circuit board from the panel.