A headset connector assembly that includes a connector plate, a casing, and electrical contact members is provided. The multi-chip package includes semiconductor chips. Cuts are made around each unitary detection element from the upper face of the stack and at least through the thickness of each semiconductor layer of the second conductivity type, entirely covering one or other of the upper and lower semiconductor layers of the first conductivity type, so as to form semiconductor zones of the second conductivity type. According to the invention, the connector also comprises an actuator to actuate this foil contact in which retaining webs are integrally formed which penetrate the foil when the actuator is closed.