A flip chip bonding method and substrate architecture are disclosed for enhancing bonding performance between a chip and a substrate by forming a bump on the chip or the substrate. The mounting clip includes a pair of resilient legs. The first and second redirectors include means for establishing and tracking sessions and means for forwarding packets to the chosen node. The plural first apertures are collaboratively defined as a solder paste printing region. The top electrode is then patterned in a separate process from the bottom electrode.