The invention provides a system for reducing oxidation of a semiconductor device when it is heated, for example during wire bonding. The cover includes a number of first grooves, and the base includes a number of second grooves aligned with the first grooves. A ground adapter has a cylindrical body that selectively inserts between the fixed clamp and movable clamp and has a pair of stakes for attaching to the ground surface. The attachment member holds an RFID. A collar incorporated in the adapter interacts with a drive ram of the injector to move the locking pins into their locked position whenever the ram is forward of a rearwardmost position. The positions of the focus lens and the second zoom lens in the zoom lens group are tracked, and are controlled to approach no closer to one another than a minimum safe distance to avert collisions between the focus lens and the second zoom lens.