In a vehicle-height adjustment apparatus of a motorcycle having a hydraulic jack and a hydraulic pump attached to a hydraulic shock absorber, a structure is provided in which an oil return path of a hydraulic jack and a suction port of a hydraulic pump are not required to be opened in a sliding surface of a piston in a damper tube. Solder connection of a single-chip component 43, an integrated chip component 44, and a semiconductor chip IC2 by Pb-free solder is carried out by heat treatment at a temperature below 280\xb0 C. The personal care composition may take a variety of forms such as a leave-on composition or an emulsion or may comprise one or more actives or agents.