In one embodiment, a method for removing a resist includes irradiating, with an UV light having a wavelength of less than about 240 nm, a structure having a resist on a pattern surface in an atmosphere having oxygen. The apparatus includes multiple processing nodes and other components, and further includes a power management unit configured to set a first frequency limit for at least one of the processing nodes responsive to receiving an indication of a first detected temperature greater than a first temperature threshold. The system includes a scanner configured to read product environment data from the environmental sensor. The mixture of vapor and carrier gas are remixed to achieve a uniform vaporcarrier gas composition, which is directed toward a surface of a substrate, such as a glass substrate, where the vapor is deposited as a uniform film.