Cell overlap is removed from rows during a cell placement procedure for an integrated circuit chip. The door assembly may include a door constructed from blow-molded plastic and a hinge member receiving portion may be disposed on one side of the door. Splice plates are bolted to the gusset plates using splice bolts. The method further includes storing, in registers, the address M and a resultant bit fail vector associated with the location \u201cM\u201d of the defect found in the memory array. The invention also enables independent control of RGB without further increasing the part count. The loom includes a heat exchanger system for exchanging heat between the first lubricant and the second lubricant without fluid communication between the lubricants.