1460482610-84daaf5a-41ce-4b61-88c3-3941a088d517

This disclosure presents a heat dissipation mechanism, which conducts generated heat of a thermal device to the housing of an electronic apparatus by a metal piece fastened between the thermal device and electronic apparatus, and then dissipates heat into the air through multiple holes opened over an apparatus shell. The effective cross-section for the induction of the first nuclear reaction at a first peak for a first particle energy is higher than an effective cross-section for the induction of the second nuclear reaction at a second peak for a second particle energy. The standardized contaminated surface is used to evaluate the effectiveness of cleaning and removing techniques. In one embodiment, the sole of the shoe has one or more gaps to enable it to flex as heel height is changed. The circuitry is coupled to the optical sensing array, and utilized for generating a digital displacement signal by monitoring the intensity variation of two different digital frames, wherein the two digital frames are captured by the optical sensing array at two different time. The second portion of the anchor is received within the sleeve.