A method of using protective caps applied to a first side of a wafer in the production of microfabricated devices, such as micro-electro-mechanical systems devices. The coupler device includes at least one generally arcuate connector having a first portion engageable with the first casing and a second portion engageable with the second casing so as to connect the two casings, the connector extending at least partially circumferentially about the casing axis. When a host writes to an empty VV region, a logical disk region is allocated to the empty VV region so the formerly empty VV region becomes a filled VV region mapped to the allocated LD region. The working is performed at a heating rate of 50 to 800\xb0 C. The recovered CO2 can be further upgraded, sequestered or used in applications such as enhanced oil recovery. The process includes providing a substrate, providing a carrier, joining a first surface of the substrate to a first surface of the carrier, machining the components out of the substrate, and detaching the components from the carrier in order to separate the components.