A modular connector includes an insulative housing defining a chamber. The bed ventilator system includes an air removal extraction device at one end of a single bed, or along the lower-half sides of a shared bed, between the bottom sheet and the bed covers at the mattress top surface. In the semiconductor device, at least part of the sourcedrain impurity layer is formed in a semiconductor region containing Ge in the semiconductor substrate, and at least an element selected from a group including S, Se, and Te is contained in the semiconductor region which is deeper than a junction depth of the sourcedrain impurity layer.