This invention is directed to preventing deformation, breakage, and the like of leads in a semiconductor device, reducing the fraction of defects, and making the semiconductor device smaller and thinner. At least one flow relief is disposed in one of the ports. Application to the field of mixer taps. The heat-conducting structure includes a ferromagnetic material and is structured such that the heat-conducting structure bonds magnetically to a heat-dissipating structure with sufficient force to support the light module during the normal operation thereof when the light source is placed against the heat-dissipating structure. Such weights may be based at least partially on the usage frequency of the alphanumeric characters associated with the character codes in their respective languages.