There is provided a multilayer ceramic electronic component, including: a ceramic body formed by laminating dielectric layers having an average thickness of 0. On a circuit substrate mounted an image sensor, a plurality of light-emitting devices are mounted in the peripheral positions of the image sensor. The method further includes exposing the substrate and the defect particles to incident radiation through the fluid, and detecting, through the fluid, radiation reflected or scattered by the defect particles. A recess is defined in the upper wall. The compounds of this invention have a general Formula wherein R1 to R11 and X are defined herein. A machining tool 70 which is exchangeably clamped to a mounting section 510 of a processing head 50 of a laser processing machine has a body 720 and a piston member 730 in the body 720, and the piston member 730 supports an air motor 740, a reducer 750, a tool chuck 760, and a tap 762.