One aspect of the disclosure is directed to a heat sink assembly for dissipating heat from an electronic component. A torque transmitting arrangement is coupled to the sun gear and to the shaft of the variable power source for influencing rotation of the sun gear according to the rotation of the variable power supply shaft for causing rotation of the sun gear, thereby influencing rotation of the ring gear and the output shaft. The probe further comprises a coarse piezoelectric actuator having an electrical input. The primary driving wheel and the driver element each have mating and mutually facing engagement means. An apparatus for assembling a semiconductor device is also disclosed.