A flexible storage bag for storing food items and the like is provided with a separation material positioned to cover an aperture disposed in andor a one-way valve element attached to the storage bag. The method according to the present invention includes recording the number of failures in each IC die in nonvolatile elements on-chip at points in time over the duration of wafer level burn-in testing. The user interfaces, scheduling, and communication management are controlled by a system control software application running on a local server with an Internet connection. The apparatus is affixed to the animal by an adhesive layer. The component is in a proportion of 5 or more to less than 25 in weight ratio, based on a total weight of the components and. A semiconductor device of the present invention has a first conductive layer, a first insulating layer that is provided to be in contact with a side end portion of the first conductive layer, a second insulating layer that is provided over the first conductive layer and the first insulating layer, and a second conductive layer that is provided over the second insulating layer.